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 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SUPER BRIGHT ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LHY3333R/S46-PF
DATA SHEET
DOC. NO : REV. DATE : :
QW0905-LHY3333R/S46-PF-A01 B 05 - Nov. - 2009
DCC
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHY3333R/S46-PF Page 1/5
Package Dimensions
5.0 5.9
7.6
8.6
1.5MAX
0.5 TYP
25.0MIN
1.0MIN 2.54TYP + Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Directivity Radiation
0X -30X 30X
-60X
60X
100% 75% 50%
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHY3333R/S46-PF Page 2/5
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Symbol HYR Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 30 60 78 10 2000 -40 ~ +85 -40 ~ +100 mA mA mW UNIT
g A V J J
Static Electricity or power surge will the Use of anti-electrosatic *glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded.
Typical Electrical & Optical Characteristics (Ta=25 J )
PART NO
MATERIAL
COLOR
Forward Dominant Spectral voltage wave halfwidth length f nm @20mA(V) f Dnm
Viewing angle @20mA(mcd) 2c 1/2 (deg)
Luminous intensity
Emitted
LHY3333R/S46-PF
Lens
Min. Max. 20
Min. Max. Min. 1.7 2.6
Typ. 30
AlGaInP
Yellow Water Clear 585 592
3400 5000
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHY3333R/S46-PF Page3/5
Typical Electro-Optical Characteristics Curve
HYR CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
Forward Current(mA)
Relative Intensity Normalize @20mA
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA Normalize @25J
Forward Voltage@20mA Normalize @25J
Ambient Temperature(J )
Ambient Temperature(J )
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHY3333R/S46-PF Page 4/5
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)
Temp(C) 260 C3sec Max
260X
5 /sec max
120X
2 /sec max Preheat 60 Seconds Max
25X 0X0
50
100
150
Time(sec)
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LHY3333R/S46-PF Page 5/5
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65JO 5J 2.RH=90%~95% 3.t=240hrsO 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105JO 5J &-40JO (10min) (10min) 2.total 10 cycles
5J
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260JO 5J 2.Dwell time= 10O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230JO 5J 2.Dwell time=5O 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2


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